| 1. | The reworkable underfills technology for flip chip
倒装芯片的可修复底部填充技术 |
| 2. | Research on the thermode bonding procee for flip chip
倒装芯片热电极键合工艺研究 |
| 3. | Implementation of flip chip and chip scale technology
叩焊晶片和晶片标度技术的执行 |
| 4. | Flip chip will be a new method of packaging technology
倒装芯片将成为封装技术的最新手段 |
| 5. | Bump fabrication methods for flip chip
倒装芯片凸点制作方法 |
| 6. | Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一 |
| 7. | Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术 |
| 8. | Fcpga flip chip pin grid array
反转芯片针脚栅格阵列 |
| 9. | Fcpga flip chip pin grid array
反转芯片针脚栅格阵列 |
| 10. | Flip chip underfill technology
的芯片倒装技术 |
